Neuware - Power Electronic Packaging presents an in-depth overview of power electronic packaging design, assembly,reliability and modeling. This book is printed on demand. Seller Inventory I Published by Springer-Verlag Gmbh Feb This book also:Explains numerous types of electronic packaging design, including power discrete packaging, power IC packaging and power wafer level CSPProvides the reader with a fundamental understanding of the evolution of power packaging, while also predicting future development trends in monolithic and hybrid integrationsPresents the most advanced simulation and modeling methodologies in electronic packaging design, reliability, and assembly to insure that practitioners can fully test their power electronic packaging designsPower Electronic Packaging is an ideal book for engineers actively working in electronic packaging, assembly, material processing, reliability and failure, power electronics and devices.
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Power Electronic Packaging
Estimation of the Maximum Power Dissipation 6. Thermal Management and Design for Power Package 6.
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Cooling for Power Packaging 6. Air Flow Cooling 6. Other Cooling Methods 6. Summary 7. Material Characterization for Power Electronics Packaging 7. Epoxy Die Attach Stress Analysis 7. Epoxy Mold Compound Characterization 7. Behavior of Epoxy Mold Compound Material 7. Experimentation of Epoxy Mold Compound 7. Test Result, Modeling, and Discussion 7. Ceramic Substrate in a Power Package 7. DBC Substrate 7. Thermal Performance of Ceramic vs. DBC 7.
Power Electronic Packaging: Design, Assembly Process, Reliability and Modeling
Solder Material Characterization 7. Introduction of the Solder Material Characterization 7. Experiment Procedure 7. The Test and Characterization Results 7. Anand Model Parameter Data Fitting 7. Modified Anand Model Parameter Contents note continued: 7. Discussions and Other Solder Materials 7. Lead Frame Material Characterization 7. Summary 8. Power Package Typical Assembly Process 8.
Design, Assembly Process, Reliability and Modeling
Wafer Handling Process 8. Die Pickup 8. Die Attach 8. Material Constitutive Relations 8. Die Attach Model and Reflow Profile 8. Wire Bonding 8. Assumption, Material Properties, and Method of Analysis 8.
Optimization of Wedge Bonding for a Power Package 8. Molding 8. Molding Flow Simulation and Analysis 8.
Molding Ejection 8. Punch Process Setup 8. Experimental Data 8. Summary 9.
Power Packaging Typical Reliability and Test 9. Power Packaging Reliability and Test in General 9. Reliability Life Contents note continued: 9. Failure Rate 9. Typical Reliability Tests for Power Package 9. Power and Thermal Cycling 9. Background 9. Die Attach Process and Material Relations 9. Power Cycling Modeling and Discussion 9.
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Thermal Cycling Modeling and Discussion 9. Power Packaging Passivation Crack Analysis 9.
Ratcheting Deformation Mechanism 9. Growth of the Crack and Critical Width 9. Design Modification 9. Discussion 9. Simulation Results and Discussion of 2D Model 9. Simulation Results and Discussion of 3D Model 9. Actual Heat Sink Mounting Test 9. The typical approach is to design the product with die side by side placement in a single level module using a QFN or other standard package, but this method cannot get the benefit of smaller package size.